Layers

Mass production: 1~58 layers / Pilot run: 64 layers

Max. Thickness

Mass production: 394mil (10mm) / Pilot run: 17.5mm

Material

CME1、CME3、FR-4, High TG FR4 , Halogen-free FR4 , Polyimide ,aluminium 、Ceramic(96% Alumina)    Teflon、PTFE（F4B，F4BK）, Rogers（4003，4350,5880） Taconic（TLX-8，TLX-9）, Arlon（35N，85N） etc.

Min. Width/Spacing

Inner layer: 3mil/3mil (HOZ), Outer layer: 4mil/4mil(1OZ)

Max. Copper Thickness

UL certificated: 6.0 OZ / Pilot run: 12OZ

Min. Hole Size

Mechanical drill: 8mil（0.2mm）  Laser drill: 3mil（0.075mm）

Max. Panel Size

1150mm × 560mm

Aspect Ratio

18:01

Surface Finish

HASL, Lead free HASL, Immersion gold, Immersion tin, Immersion Silver,Plated gold , OSP, Carbon ink, ENEPIG, Gold Finger

Special Process

Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control.

Testing

XRAY Inspection ,AOI Testing , ICT，Probe flying，burn-in，function test，temperature cycling.