Quality Control
CJPCBA Quality Control Plan
NO | process name/ Operation description | Machinery, equipment, tooling fixture | Procedure name/operation description | Product/Process Standard/Tolerance |
---|---|---|---|---|
1 | Receive material | forklift | 1.Customer code; 2. Incoming materials list; |
1. Check whether the customer supplied materials have a code; 2. The material box contains an incoming materials list; |
2 | IQC inspection | Visually magnifier LCR multimeter CCD Static ring/finger cot |
1.P/N 2. Environmental protection requirements 3. Appearance/Material 4. Resistor and capacitance values, specifications and models 5. Suppliers 6. Brand and cycle |
1. Check that the P/N and material specification description of the material must be consistent with the system BOM and ECN 2. Check whether the surface of the components is damaged or deformed. 3. Test whether the material specification parameters are consistent with the BOM; 4. Whether the connector and PCB are consistent; 5. Whether there are defects such as blackening, warped legs, etc. on the surface of the material; |
3 | warehouse storage | forklift Moisture-proof cabinet Pointing machine oven Static ring/finger cot |
1. Environmental protection classification and storage 2. Temperature and humidity 3. Anti-static of ESD components Storage environment Storage environment 4. Separate storage of materials 5. Stack height 6. First in, first out |
1. Warehouse environment temperature requirements: 22-28℃, humidity: 40%-75%; 2. The storage environment of ESD components must comply with anti-static requirements, and anti-static facilities must be inspected regularly 3. The stacking height of materials must meet the requirements for external labeling of materials. If there are no special requirements for materials, refer to the "Warehouse Management Procedures" according to the requirements of relevant warehouse documents.; 4. Strictly implement the distribution management of materials in accordance with first-in, first-out requirements; 5. PCB/Class A materials are baked according to baking standards; |
4 | Prepare materials | Trolley Static ring/finger cot |
1. Production picking and preparing materials, 2. Warehouse material issuance and specification cycle Insurance category distinction 3. Equipment, instruments, test racks, clamps tool, tool confirmation 4. Solder paste thawing time |
1. picking list; 2. TThe defrosting time of solder paste must meet 4 hours, and the stirring time must meet 3 minutes.; 3. Refer to the "Production Process Control Procedures", "Process Inspection Management Procedures", "Identification and Traceability Management Procedures", and "Solder Paste Control Operation Instructions" |
5 | Solder paste printing | mixer, printing press. put Large mirror Static ring/finger cot |
1. Fully automatic tin printing machine program confirmation; 2. Steel mesh confirmation 3. Solder paste model and environmental label confirmation; 4. Rewarming and stirring the solder paste 5. Solder paste printing thickness quality; |
1. Steel mesh thickness standard 0.12±0.05mm; 2. The solder paste temperature recovery time is 4 hours, the stirring time is 180s, and the bottle opening time is ≤24H. Reference documents: "Solder Paste Printing Inspection Standard", "Steel Mesh Cleaning Operation Instruction", "Solder Paste Control Operation Instruction", "Printing Machine Maintenance Instructions"; 3. Solder paste model: Alpha OM-338-PT; 4. The printing machine (reference) parameters are: scraper pressure: 4-8kg, scraper speed: 40-80mm/s, demoulding speed: 0.1-2mm/s, demoulding distance: 1.5-2mm, scraper Choice: 200~300mm (depending on the actual situation), cleaning frequency: wet wipe/dry wipe/vacuum wipe 1~4 panels/time |
6 | SP inspection | SPI | 1. Solder paste thickness 2. Printing appearance inspection |
1. SPI (reference) parameters are: height 70%-180%, area 70%-180%, volume: 70%-180%, offset 30%.
; 2. Solder paste area: ±20% of the standard value; 2. There should be no printing defects such as missing printing, shifting, missing tin, continuous tin, collapse, etc. |
7 | Machine patch | SMT machine | 1. SMT process 2. SMT appearance standard |
1. The component model and position must be consistent with the BOM and PCB; 2. The component must be placed correctly, without offset, tilt, etc.; 3. The component must be free from damage and deformation; |
8 | Furnace inspection | magnifier Static ring/finger cot | 1. SMT process 2. SMT appearance standard |
1. Inspect according to the "Appearance Inspection Standards; 2. Refer to the "SMT Placement Station Operation Instructions; 3. There should be no flying materials, missed pasting, offset, wrong pasting, reverse, etc.; |
9 | Reflow soldering | Reflow soldering | 1. Furnace temperature setting value 2. Reflow oven chain speed |
1. Temperature curve must comply with the solder paste specifications; 2. Conveyor speed: 30-150cm/min; 3. Nitrogen concentration: ≥95%; 4. Cooling rate: ≤4℃/s; |
10 | X-Ray inspection | X-Ray device Static ring/finger cot | BGA packaging material welding inspection | Inspect according to IPC-A-610G standard;; |
11 | AOI inspection | AOI equipment Static ring/finger cot | 1. AOI program confirmation; 2. Appearance inspection |
1. Inspect the first piece according to the "Appearance Inspection Standard" and IPQC verification. There are no wrong parts, missing parts, reversed parts, few parts, too many parts, empty welding, empty welding, tin connection, floating height, and deflection.; 2. Refer to the "AOI Operation Instructions" for operation |
12 | plug-in | Material box Static ring/finger cot | 1. Product consistency 2. Plug-in position |
1. According to the "Product BOM" 2. based on the "Product Silk Screen Picture; 3. Refer to the "Product SO; 4. First article checked with reference to IPQC; |
13 | Visual inspection before furnace | sample Static ring/finger cot | 1. Plug-in feature requirements 2. The accuracy of the plug-in |
1. Wave Soldering Operation Guide" "Product Operation Instructions; 2. Preheating temperature: 100-150℃; 3. Soldering temperature: 250-270℃; 4. Solder joints must be smooth and shiny; |
14 | wave soldering | Wave soldering equipment | 1. Furnace temperature setting value 2. Wave soldering chain speed and air 3. Welding quality 4. Pin row appearance |
1.Wave Soldering Operation Guide" "Product Operation Instructions; 2.Wave soldering temperature setting, refer to wave soldering furnace temperature setting specifications; 3. Preheating (110℃ 120℃ 130℃)±20℃ Furnace temperature 260℃±5℃ Chain speed 0.8-1.6m/min; |
15 | Visual inspection | QC report Static ring/finger cot | 1. Inspection environment 2. Inspection frequency 3. Inspection method 4. Defective product confirmation and feedback |
1.Refer to the latest version of IPC-A-610 standard; 2. Inspection based on the "Appearance Inspection Standards" |
16 | Short circuit test | multimeter Static ring/finger cot | 1. Measure USB/socket solder joint performance 2. Test SOP and pictures |
1. Use a multimeter to test the 7 USB solder joints;; 2. Short circuit detection at test point K8/K9 on the opposite side of the female base position; |
17 | repair | heat gun Static electricity bracelet Soldering iron temperature tester Static ring/finger cot | 1. Air gun temperature and usage precautions 2. Appearance and status distinction after repair 3. Component desoldering requirements and special maintenance instructions 4. Product testing after repair |
1. Maintenance and one-to-one replacement of materials; 2. PCBA appearance and soldering effect confirmed to be OK; 3. Mark maintenance marks as required and send them for inspection separately and keep the board surface and solder joints clean; 4. Rerun the test process according to the process flow; |
18 | Visual inspection | QC report Static ring/finger cot | 1. TInspection environment 2. TInspection frequency: 3. Inspection method 4. Defective product confirmation and feedback |
1. Refer to the latest version of IPC-A-610 standard; 2. Inspection based on the "Appearance Inspection Standards; |
19 | OQC inspection | Inspection Report Static ring/finger cot | 1. Appearance 2. Size, function and reliability random test |
1. Inspection reference documents: "Control Procedure for Nonconforming Products" and "IPC-A-610-G Standard" first sample; 2. Sampling Sampling plan reference C = 0; Sampling inspection plan: adopt a normal inspection one-time sampling plan; Inspection level: Dimensional inspection adopts General II; Acceptance level: C = 0; |
20 | Package | carton Static ring/finger cot | 1. Packaging requirements and quantity confirmation 2. Labels are clear and complete 3. The actual object is consistent with the logo |
1. Packaging must be intact; 2. Labels must be clear and correct; 3. No damage to products during packaging; |
21 | warehouse storage | forklift shelves Card board |
Warehouse receipt | temperature, humidity, height, quantity |
22 | Ship | forklift | 1. Customer order confirmation 2. Confirm the outer box mark 3. Confirm delivery quantity 4. Shipping address confirmation 5. Transportation requirements |
Refer to the order contract and "Warehouse Management Procedures |