PCBA Capability
Turnkey OEM PCBA Manufacturing in China -CJPCBA
From prototype to production, we solder trust into every board.
Article | Description | Capability |
Material | Laminate materials | FR4,Alu,CEM3,Taconic,Rogers |
Board cutting | Number of layers | 1-58 |
Min. Thickness for inner layers (Cu thickness are excluded) | 0.003”(0.07mm) | |
Board thickness | Standard | 0.04-0.16”±10%(0.1-4mm±10%) |
Min. | Single/Double layer: 0.008±0.004” | |
4 layer: 0.01±0.008” | ||
8 layer: 0.01±0.008” | ||
Bow and twist | <7/1000 | |
Copper weight | Outer Cu weight | 0.5-4 oz |
Inner Cu weight | 0.5-3 oz | |
Drilling | Min size | 0.0078” (0.2mm) |
Drill deviation | ±0.002” (0.05mm) | |
PTH hole tolerance | ±0.002” (0.005mm) | |
NPTH hole tolerance | ±0.002” (0.005mm) | |
Plating | Min hole size | 0.0008” (0.02mm) |
Aspect ratio | 20 (5:1) | |
Solder mask | Color | Green,white,black,red,yellow,blue… |
Min solder mask clearanace | 0.003” (0.07mm) | |
Thickness | 0.0005-0.0007”(0.012-0.017mm) | |
Silkscreen | Color | White,black,yellow,red,blue… |
Min size | 0.006” (0.15mm) | |
E-test | Flying Probe Tester | Y |
Controlled Impedance | Tolerance | ±10% |
Impedance tester | Tektronix TDS8200 | |
Surface Finish | HASL,ENIG,immersion silver,immersion tin,OSP… | |
Type of Assembly | SMT and Thru-hole | |
Components | Passives Down to 0201 Size BGA and VFBGA Leadless Chip Carrier/CSP Double-Sided SMT Assembly Fine Pitch to 08 Mil BGA Repair and ReballPart Removal and Replacement-Same Day Service | |
Capacity | 50 million placements per month | |
Testing | XRAY Inspection ,AOI Testing , ICT，Probe flying，burn-in，function test，temperature cycling. | |
Quantity | No MOQ, Prototype & Low Volume & Mass assembly | |